Case Study
IMAP-FU is focusing on DEM(Device Embedded Module), High Frequency,and
Fine Wiring from aspects of research activities of theory and applications.
- DEM(Device Embedded Module)
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●Full Bridge Embedded Power Module
●Evaluation Technolory of DEM
- High Frequency
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●High Frequency Transmission Property Evaluation Technology
●Various-leve Evaluation Kits
●mmWave range evaluation: Keysight PNA system N5291A
- Fine RDL
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Regarding the fine RDL technology, which is the key technology for highly integrated semiconductor substrates, IMAP-FU supports fine RDL with an L/S=1μm/1μm. We develop and provide SI series.
●Platform Development KIT: Ultra Fine RDL+Via
- International Contribution to Semiconductor Packaging Laboratories
International Standardization Activities
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The Semiconductor Packaging Laboratory is promoting IEC international standardization activities for component interior boards.
●Example of stacked Device embedded module(DEM): 1
★ Co-production with Fujitsu Interconnect Technologies, Fukuoka IST and Fukuoka University
●Example of stacked Device embedded module(DEM): 2
★ Co-production with Fujitsu Interconnect Technologies, Fukuoka IST and Fukuoka University