■The Institute of Microelectronics Assembling and Packaging (IMAP-FU) was established in April 2011 as one of the Industry-Academia-Government Collaborative and Cooperative Research Institutes (currently the Industry-Academia-Government Collaborative Research Institutes) of the Research Promotion Department of Fukuoka University, with the aim of assembling semiconductors in three dimensions and developing high-density, high-performance electronic components. The location is inthe 3D Semiconductor Research Centerin Itoshima City, Fukuoka Prefecture.It is a research institute where not only researchers, graduate students, and undergraduate students of Fukuoka University, but also industry, academia, and government from other universities and companies collaborate to conduct research and development.
■We can perform a series of processes from design to prototyping, analysis, and testing, and we have established a development system in collaboration withthe Fukuoka Industrial and Technology Promotion Foundation (Fukuoka IST)to support the development of companies. We also aim to standardize installation methods and reliability test methods.