IMAP-FU is focusing on DEM(Device Embedded Module), High Frequency, and Fine Wiring from aspects of research activities of theory and applications.
DEM(Device Embedded Module)
●Full Bridge Embedded Power Module
*Power DEM was Prototyped in the NEDO Feasibility Study Program 2022
●Evaluation Technology of DEM
High Frequency
●High Frequency Transmission Property Evaluation Technology
●Various-level Evaluation Kits
●mmWave range evaluation: Keysight PNA system N5291A
Fine RDL
Regarding the fine RDL technology, which is the key technology for highly integrated semiconductor substrates, IMAP-FU supports fine RDL with an L/S=1μm/1μm. We develop and provide SI series.
●Platform Development KIT: Ultra Fine RDL+Via
